AMD patent points to new MCM GPU design for RDNA3 – TechRadar

It appears like MCM is finally coming to Radeon if a new patent by AMD is any indication.The multi-chip module architecture was submitted to the United States patent office on December 31, 2020, simply under the wire for completion of the year. The file, flagged by LaFriteDavid on Twitter, reveals that AMD is planning to build a brand-new GPU based upon a chiplet style rather than the monolithic structure it has utilized for previous GPU builds.

Rumors have swirled about AMDs plans to transfer to an MCM structure ever given that talk about Nvidia’s relocate to an MCM design with it’s rumored Hopper architecture, so this most current patent actually isn’t really surprising.Is multi-chip module designs the future? Among the major obstacles to the MCM style in the past, according

to Wccftech, has actually been the high latency in between chiplets and the increased difficulty in implementing parallelism.AMD appears to resolve these difficulties utilizing what it calls a high-bandwidth passive crosslink. Obviously, this enables each GPU to communicate straight with the CPU and its buddy chiplets with significantly less latency.With Nvidia and Intel both looking at MCM for future GPU designs in addition to AMD, it appears like MCM is very much the future of GPUs moving forward.

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